Title :
Investigation on output driver with stacked devices for ESD design window engineering
Author :
Cao, Shuqing ; Chun, Jung-Hoon ; Choi, Eunji ; Beebe, Stephen ; Anderson, Warren ; Dutton, Robert
Author_Institution :
Electr. Eng. Dept., Stanford Univ., Stanford, CA, USA
Abstract :
This work investigates the ESD robustness of stacked drivers in bulk and SOI technologies. The impact of stacked driver sizing and pre-driver connection is examined in detail using VF-TLP and TLP measurement. It is shown that proper pre-driver configuration can double Vt2, thereby improving I/O´s It2.
Keywords :
driver circuits; electrostatic discharge; silicon-on-insulator; transmission lines; ESD design window engineering; SOI technology; TLP measurement; VF-TLP; output driver; stacked devices; stacked driver sizing; Clamps; Driver circuits; Electrostatic discharge; Integrated circuit interconnections; Logic gates; Transient analysis;
Conference_Titel :
Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Conference_Location :
Reno, NV
Print_ISBN :
978-1-58537-182-2
Electronic_ISBN :
978-1-58537-182-2
