Title :
Overcoming the unselected pin relay capacitance HBM tester artifact with two pin HBM testing
Author :
Ward, Scott ; Burgess, Keith ; Grund, Evan ; Schichl, Joe ; Duvvury, Charvaka ; Koeppen, Peter ; Kunz, Hans
Author_Institution :
Texas Instrum., Dallas, TX, USA
Abstract :
HBM tester parasitic capacitances are shown to degrade the current pulse rise-times on the ground path return. Rise-times longer than allowed in the HBM specification may cause failures on devices with transiently triggered ESD protection networks. Two pin HBM testing and TLP measurements have verified such failures as being induced by tester parasitics. Updates to the HBM standard are needed to address this testing issue.
Keywords :
electrostatic discharge; failure analysis; test equipment; testing; HBM tester parasitic capacitances; TLP measurements; current pulse rise-times degradation; ground path return; pin HBM testing; transient triggered ESD protection networks; unselected pin relay capacitance HBM tester artifact; Capacitance; Clamps; Current measurement; Electrostatic discharge; Pins; Relays; Stress;
Conference_Titel :
Electrical Overstress/ Electrostatic Discharge Symposium (EOS/ESD), 2010 32nd
Conference_Location :
Reno, NV
Print_ISBN :
978-1-58537-182-2
Electronic_ISBN :
978-1-58537-182-2
