Title :
Research on key Technology of MID
Author_Institution :
Coll. of Inf. Sci. & Technol., Qingdao Univ. of Sci. & Technol., Qingdao, China
Abstract :
This paper introduced the three-dimensional molding mechanical and electrical integration unit, Molded Interconnect Devices (MID) of this new type of electronic components, and the key Technology from their composition, functions, processing methods, the MID Briefing, and pointed out its development prospects to the future.
Keywords :
compression moulding; MID briefing; MID key technology; electronic components; mechanical-electrical integration unit; molded interconnect devices; three dimensional molding; Algorithm design and analysis; Geometry; Lasers; Metallization; Production; Assembly; MID; Molded Interconnect Devices; Three-dimensional circuit;
Conference_Titel :
Circuits,Communications and System (PACCS), 2010 Second Pacific-Asia Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-7969-6
DOI :
10.1109/PACCS.2010.5627048
