Title :
A Low-Cost Electric Field Energy Harvester for an MV/HV Asset-Monitoring Smart Sensor
Author :
Moghe, R. ; Iyer, Amrit ; Lambert, F.C. ; Divan, D.
Author_Institution :
Varentec Inc., San Jose, CA, USA
Abstract :
This paper investigates the powering of smart grid sensors with electric fields (E-fields) present in abundance near most medium-voltage to high-voltage (MV/HV) utility assets. A unique E-field energy harvester is proposed, which is integrated into a sensor´s enclosure, thereby ensuring low-cost and compact size. The proposed energy harvester can be used with multiple assets by virtue of its shape, which also allows installation without interruption of the MV/HV asset. Design methodology of the harvester through Maxwell simulations along with a new and efficient circuit design for obtaining a regulated dc supply is presented. A medium-voltage prototype of the proposed E-field energy harvester integrated with a wireless voltage sensor is built and tested on a 35-kV bus. The prototype provides 17 mW of continuous power at 35 kV with a high energy density. This power is enough to operate a low-duty-cycle sensor node stuck on to an MV/HV asset. The prototype shows promising results and demonstrates the efficacy of using E-fields for powering smart grid sensors for MV/HV assets.
Keywords :
Maxwell equations; electric field measurement; electric sensing devices; energy harvesting; intelligent sensors; power system measurement; smart power grids; voltage measurement; wireless sensor networks; MV-HV asset-monitoring smart grid sensor; MV-HV utility asset; Maxwell simulation; e-field energy harvester; electric field energy harvester; low-duty-cycle sensor node; medium-voltage to high-voltage utility asset; power 17 mW; regulated DC supply; voltage 35 kV; wireless voltage sensor; Capacitors; Conductors; Density measurement; Energy harvesting; Magnetic sensors; Power system measurements; Electric fields (E-fields); energy harvesting; smart sensors;
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2014.2354741