Major achievements of the NANOPACK project

Author

Demoustier, S. ; Ziaei, A.

Author_Institution

Thales Res. & Technol. - France, Palaiseau, France

fYear

2010

fDate

6-8 Oct. 2010

Firstpage

1

Lastpage

3

Abstract

NANOPACK-Nano Packaging Technology for Interconnect and Heat Dissipation- is a European large-scale integrating project aiming at the development of new technologies and materials for low thermal resistance interfaces and electrical interconnects, by exploring the capabilities offered by nanotechnologies such as carbon nanotubes, nanoparticles and nano-structured surfaces, and by using different enhancing contact formation mechanisms, compatible with high volume manufacturing technologies. Major achievements of the project will be presented, in particular in the fields of low resistance thermal interface materials, their modeling and their characterization.

Keywords

carbon nanotubes; cooling; integrated circuit interconnections; integrated circuit packaging; nanoparticles; nanotechnology; thermal management (packaging); European large-scale integrating project; NANOPACK project; carbon nanotube; contact formation; electrical interconnects; heat dissipation; high volume manufacturing technology; low thermal resistance interface; nano packaging technology; nanoparticle; nanostructured surface; nanotechnology; thermal interface material; Conductivity; Electronic packaging thermal management; Materials; Surface resistance; Thermal conductivity; Thermal resistance; Thermal Interface materials; thermal characterization;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on

Conference_Location

Barcelona

Print_ISBN

978-1-4244-8453-9

Type

conf

Filename

5636306