• DocumentCode
    534317
  • Title

    Hot-spot self-cooling effects on two-phase flow of R245fa in 85µm-wide multi-microchannels

  • Author

    Costa-Patry, E. ; Olivier, Jeremy ; Paredes, S. ; Thome, John R.

  • Author_Institution
    Heat & Mass Transfer Lab. (LTCM), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
  • fYear
    2010
  • fDate
    6-8 Oct. 2010
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Two-phase refrigerant flow boiling was shown to be effective in handling hot-spots. The footprint heat transfer coefficients followed the local heat flux and formed a self-compensating cooling mechanism by increasing the local heat transfer coefficient at the hot-spot. Data reduction using one-dimensional heat conduction overestimated the heat transfer coefficient at the hot-spots and underestimated it around its location. Heat spreading effects should be taken into account for more precise calculations (work in progress). Existing two-phase heat transfer prediction methods for micro-channels are accurate and can be applied to nonuniform heat flux conditions, independently of the data reduction method. The three-zone model of Thome et al. was found to be the most accurate, placing 53.3% of the predicted data within ±30% of the experimental values. If the hot-spot is placed toward the outlet, the resulting pressure drop will be smaller and the base temperature lower. The thermal resistance of two-phase flow cooling decreased with increasing heat flux and became smaller than that of the composite wall at high heat fluxes.
  • Keywords
    cooling; microchannel flow; refrigerants; thermal resistance; two-phase flow; R245fa; heat conduction; heat flux; heat spreading effect; heat transfer; hot-spot self-cooling effect; multimicrochannels; pressure drop; size 85 micron; thermal resistance; two-phase refrigerant flow boiling; Fluids; Heat transfer; Heating; Refrigerants; Resistance; Hot-spot; chip cooling; flow boiling; microchannels; thermal performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on
  • Conference_Location
    Barcelona
  • Print_ISBN
    978-1-4244-8453-9
  • Type

    conf

  • Filename
    5636318