DocumentCode :
534317
Title :
Hot-spot self-cooling effects on two-phase flow of R245fa in 85µm-wide multi-microchannels
Author :
Costa-Patry, E. ; Olivier, Jeremy ; Paredes, S. ; Thome, John R.
Author_Institution :
Heat & Mass Transfer Lab. (LTCM), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
fYear :
2010
fDate :
6-8 Oct. 2010
Firstpage :
1
Lastpage :
6
Abstract :
Two-phase refrigerant flow boiling was shown to be effective in handling hot-spots. The footprint heat transfer coefficients followed the local heat flux and formed a self-compensating cooling mechanism by increasing the local heat transfer coefficient at the hot-spot. Data reduction using one-dimensional heat conduction overestimated the heat transfer coefficient at the hot-spots and underestimated it around its location. Heat spreading effects should be taken into account for more precise calculations (work in progress). Existing two-phase heat transfer prediction methods for micro-channels are accurate and can be applied to nonuniform heat flux conditions, independently of the data reduction method. The three-zone model of Thome et al. was found to be the most accurate, placing 53.3% of the predicted data within ±30% of the experimental values. If the hot-spot is placed toward the outlet, the resulting pressure drop will be smaller and the base temperature lower. The thermal resistance of two-phase flow cooling decreased with increasing heat flux and became smaller than that of the composite wall at high heat fluxes.
Keywords :
cooling; microchannel flow; refrigerants; thermal resistance; two-phase flow; R245fa; heat conduction; heat flux; heat spreading effect; heat transfer; hot-spot self-cooling effect; multimicrochannels; pressure drop; size 85 micron; thermal resistance; two-phase refrigerant flow boiling; Fluids; Heat transfer; Heating; Refrigerants; Resistance; Hot-spot; chip cooling; flow boiling; microchannels; thermal performance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on
Conference_Location :
Barcelona
Print_ISBN :
978-1-4244-8453-9
Type :
conf
Filename :
5636318
Link To Document :
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