• DocumentCode
    534338
  • Title

    Miniaturized black body radiator for IR-detector calibration — Design and development

  • Author

    Schacht, R. ; Gerner, Ch ; Nowak, T. ; May, D. ; Wunderle, B. ; Michel, B.

  • Author_Institution
    Fraunhofer Inst. Reliability & Microintegration, Berlin, Germany
  • fYear
    2010
  • fDate
    6-8 Oct. 2010
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Nowadays very often IR-thermography is used to analyze the temperature on electronic device surfaces. To measure the absolute surface temperature correctly, the IR-camera detector has to be calibrated with an corresponding evaluation software using a black body calibration device. Commercially available black radiators are heavyweight and a calibration of macro-lenses is not possible due to mismatch of the macro lens diameter and the structural design of the radiator. This paper describes the design and realization of a mobile, miniaturized black body calibration device (mass ~ 500 g) which supports macro lenses as well. To realize a temperature range of -5°C to 130°C, a Peltier element as cooling source and a flip-chip mounted thermal test die (TTD) as black radiator heat source, with an including temperature measuring instrument, were used. First temperature stability and calibration tests for the new TTD black radiator show a suitable resolution of 0.1 K. An verification with a commercially available calibration device was done.
  • Keywords
    flip-chip devices; infrared detectors; infrared imaging; IR-camera detector; IR-detector calibration; IR-thermography; TTD black radiator; black radiator heat source; calibration tests; cooling source; electronic device surfaces; flip-chip mounted thermal test die; macrolenses; miniaturized black body radiator; surface temperature; temperature range; temperature stability; Bridge circuits; Calibration; Heat sinks; Lenses; Semiconductor device measurement; Temperature; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on
  • Conference_Location
    Barcelona
  • Print_ISBN
    978-1-4244-8453-9
  • Type

    conf

  • Filename
    5636354