Analysis of the temperature distribution during embossing of diffractive optical elements by numerical simulation

Author

Delette, Gerard ; Pauty, Emmanuel ; Baum, Christoph ; Voicu, R.

Author_Institution

Liten, CEA Grenoble, Grenoble, France

Volume

01

fYear

2010

fDate

11-13 Oct. 2010

Firstpage

165

Lastpage

168

Abstract

Hot embossing is a promising technology which can be integrated in a process chain for cost effective production of planar lighting optics. Polyamide polymer material was selected in order to fulfil the requirements of the process: embossing, conductive coating process followed by the electro deposition and removal of the substrate to produce the final master. However, it has been further optimised in order to increase the thermal conductivity and improve the reliability of the process. Finite Element Modelling has been performed in order to analyse thermal features of embossing step as a function of materials and process parameters.

Keywords

diffractive optical elements; electrodeposition; embossing; finite element analysis; optical fabrication; optical films; optical polymers; temperature distribution; thermal conductivity; conductive coating; diffractive optical elements; electrodeposition; finite element modelling; hot embossing; numerical simulation; polyamide polymer material; temperature distribution; thermal conductivity; Conductivity; Cooling; Embossing; Heating; Substrates; Thermal conductivity; Hot embossing; Thermal analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Conference (CAS), 2010 International

Conference_Location

Sinaia

ISSN

1545-827X

Print_ISBN

978-1-4244-5783-0

Type

conf

DOI

10.1109/SMICND.2010.5649060

Filename

5649060