DocumentCode
537733
Title
An Improved LIEP Method Utilizing Electrothermal Technology
Author
Ji, Qiaoling ; Jiang, Yi ; Ji, Xiaowei
Author_Institution
Sch. of Mech. Eng., Jiangxi Ganjiang Vocational Coll., Nanchang, China
Volume
1
fYear
2010
fDate
11-12 Nov. 2010
Firstpage
217
Lastpage
220
Abstract
Laser Induced Electroless Plating(LIEP) has many advantages such as homogeneous microstructure, relatively low cost, feasibility to be applied on non-metal substrates and operated at room temperature with relative simple equipment, and thus received much attentions in flexible circuit making. But the wide application of LIEP is also limited by poor accuracy, low speed and low repeatability brought by the temperature, concentration, thickness of plating solution. An improved approach is proposed in this paper aiming at enhancing the Laser Induced Electroless plating on the fabric utilizing the AC electrothermal technology. A mathematical model is also established and the simulation is carried out. The results show that it is not only effective and feasible, but also capable of minimizing the pollution greatly, and thus of great convenience for future micro electro mechanical systems and its microfabraction.
Keywords
coating techniques; flexible electronics; laser materials processing; micromechanical devices; AC electrothermal technology; flexible circuit making; homogeneous microstructure; improved LIEP method; laser induced electroless plating; mathematical model; microelectromechanical systems; microfabraction; nonmetal substrates; plating thickness; relative simple equipment; room temperature; Laser Induced Electroless Plating i LIEPj; electrothermal technology; flexible circuit; microfabraction;
fLanguage
English
Publisher
ieee
Conference_Titel
Optoelectronics and Image Processing (ICOIP), 2010 International Conference on
Conference_Location
Haiko
Print_ISBN
978-1-4244-8683-0
Type
conf
DOI
10.1109/ICOIP.2010.305
Filename
5663217
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