• DocumentCode
    537733
  • Title

    An Improved LIEP Method Utilizing Electrothermal Technology

  • Author

    Ji, Qiaoling ; Jiang, Yi ; Ji, Xiaowei

  • Author_Institution
    Sch. of Mech. Eng., Jiangxi Ganjiang Vocational Coll., Nanchang, China
  • Volume
    1
  • fYear
    2010
  • fDate
    11-12 Nov. 2010
  • Firstpage
    217
  • Lastpage
    220
  • Abstract
    Laser Induced Electroless Plating(LIEP) has many advantages such as homogeneous microstructure, relatively low cost, feasibility to be applied on non-metal substrates and operated at room temperature with relative simple equipment, and thus received much attentions in flexible circuit making. But the wide application of LIEP is also limited by poor accuracy, low speed and low repeatability brought by the temperature, concentration, thickness of plating solution. An improved approach is proposed in this paper aiming at enhancing the Laser Induced Electroless plating on the fabric utilizing the AC electrothermal technology. A mathematical model is also established and the simulation is carried out. The results show that it is not only effective and feasible, but also capable of minimizing the pollution greatly, and thus of great convenience for future micro electro mechanical systems and its microfabraction.
  • Keywords
    coating techniques; flexible electronics; laser materials processing; micromechanical devices; AC electrothermal technology; flexible circuit making; homogeneous microstructure; improved LIEP method; laser induced electroless plating; mathematical model; microelectromechanical systems; microfabraction; nonmetal substrates; plating thickness; relative simple equipment; room temperature; Laser Induced Electroless Plating i LIEPj; electrothermal technology; flexible circuit; microfabraction;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronics and Image Processing (ICOIP), 2010 International Conference on
  • Conference_Location
    Haiko
  • Print_ISBN
    978-1-4244-8683-0
  • Type

    conf

  • DOI
    10.1109/ICOIP.2010.305
  • Filename
    5663217