DocumentCode :
538619
Title :
Development of SMA thin film deposited on buffer layer
Author :
Tsuchiya, K. ; Sato, T.
Author_Institution :
Dept. of Precision Eng., Tokai Univ., Hiratsuka, Japan
fYear :
2010
fDate :
12-15 Dec. 2010
Firstpage :
193
Lastpage :
194
Abstract :
The shape memory effect for TiNi to improve by using strain in the thin film deposited on a buffer layer (Nb, Mo, Ta, and W) has been investigated. First of all, the contact points on each surface between TiNi thin film and buffer layers (where the contact point is defined as atomic position difference for bonding between each atom on lattice axis in both surface of thin film and buffer layer) were calculated to obtain the mismatch rate under 1 %. Secondly, TiNi thin films on each buffer layers deposited by ECR sputter deposition method were evaluated by XRD and these strains in the films by changed lattice constants by the effect of buffer layer were also calculated from the sifted incident angles based on ICDD. As the result, the relationship between contact points and strained lattice constant in thin film calculated by using data based on XRD intensity data showed strong negative correlations and the contact points is effective to control the lattice constant of the thin films to give the strain into the thin film.
Keywords :
X-ray diffraction; buffer layers; internal stresses; lattice constants; metallic thin films; nickel alloys; shape memory effects; sputter deposition; titanium alloys; ECR sputter deposition; Mo; Nb; Ta; TiNi; W; XRD; atomic position difference; buffer layers; lattice axis bonding; shape memory alloy thin film; shape memory effect; strained lattice constants; surface contact points; Argon; Films; Niobium; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optoelectronic and Microelectronic Materials and Devices (COMMAD), 2010 Conference on
Conference_Location :
Canberra, ACT
ISSN :
1097-2137
Print_ISBN :
978-1-4244-7334-2
Electronic_ISBN :
1097-2137
Type :
conf
DOI :
10.1109/COMMAD.2010.5699735
Filename :
5699735
Link To Document :
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