TLS-Dicing - the way to higher yield and throughput

The Thermal-Laser-Separation (TLS) separates brittle materials by well known basic principles with laser induced thermo mechanical stress. TLS-Wafer-dicing is an interesting alternative to the established mechanical dicing saws and has many advantages, compared to the other known laser technologies. The outstanding feature is the excellent edge quality, which is the reason for significant higher mechanical breaking forces and improved electrical and optical properties of the separated electrical components. TLS-wafer-dicing works much faster than the mechanical saw, especially for the increasingly used very thin wafers and increases the throughput. The yield becomes higher by using the zero-width of the separation line and reducing the dicing street width.