Highly accurate management in dynamically changing fab

Semiconductor fab capability improvement is usually discussed in the context of static conditions. This paper focuses on rapidly changing fab in the midst of capability improvement and describes the fab operations that maximize throughput while maintaining the cycle time in such a dynamic environment. Turn and Move are defined as parameters that indicate daily operation performance. The manufacturing process is divided into several segments where the Turn is maintained uniformly in each segment, while the increased Move capability is sequentially-allocated and shifted from one segment to the next, from input side to output side of each manufacturing process. The effectiveness of this method has been demonstrated in a NOR Flash Memory Fab.