DocumentCode :
539396
Title :
Centering value by using TSMRA prediction of CD process variation
Author :
Murashima, Shigenobu ; Mizuhara, Noriaki ; Nishimura, Susumu
Author_Institution :
NEC Semiconductors Kansai, Ltd, 9-1, Seiran 2-Chome, Otsu City, Shiga 520-8555, Japan
fYear :
2008
fDate :
27-29 Oct. 2008
Firstpage :
277
Lastpage :
280
Abstract :
This paper presents the accurate control method of process parameters by TSMRA: time series analysis added multiple regression analysis. This method has been applied to gate CD process of microwave devices and the best yield has been achieved.
Keywords :
Correlation; Equations; Etching; Mathematical model; Process control; Time series analysis; Tuning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing (ISSM), 2008 International Symposium on
Conference_Location :
Tokyo, Japan
ISSN :
1523-553X
Electronic_ISBN :
1523-553X
Type :
conf
Filename :
5714917
Link To Document :
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