DocumentCode
539443
Title
Analysis of Deep Scratch
Author
Takeda, Daisuke ; Takahashi, Teruhiko ; Tsuken, Tadamichi
Author_Institution
Spansion Japan CO., Ltd., 2-Takaku-Aizuwakamatsu-shi Fukushima 965-0000 Japan
fYear
2008
fDate
27-29 Oct. 2008
Firstpage
394
Lastpage
397
Abstract
Minute contact short can be generated between the contact plugs after a fragile film such as BPSG is polished, and it causes a serious fault on the function of the device. The yield decreases by as much as 27% (worst case). This defect is called Deep Scratch. The mechanism of the Deep Scratch was examined and we successfully verified the mechanism.
Keywords
Cleaning; Etching; Films; Semiconductor device modeling; Shape; Silicon compounds; Slurries;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Manufacturing (ISSM), 2008 International Symposium on
Conference_Location
Tokyo, Japan
ISSN
1523-553X
Electronic_ISBN
1523-553X
Type
conf
Filename
5714965
Link To Document