Life Predict and Simulation of the Copper Wire in Flexible Printed Circuit Board

Author

Wang, Hai-feng ; Yang, Ping ; Bao, Bi-zheng

Author_Institution

Dept. of Mechatron. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China

Volume

2

fYear

2011

fDate

6-7 Jan. 2011

Firstpage

470

Lastpage

472

Abstract

Fatigue failure of the circuit board´s research focuses on the influence to the circuit board of vibration of rigid circuit board type, distribution of Electronic Components on the board etc. And there is relatively little research to the flexible circuit board´s fatigue life research. Local stress-strain method is used to predict the fatigue life. Simulate actual fatigue test load conditions to established finite element model of flexible printed circuit board. Perform fatigue analysis under the periodicity stress. Drawn fatigue life of copper wire in different loading conditions. There is guiding significance to the follow-up test.

Keywords

circuit testing; fatigue; finite element analysis; printed circuits; copper wire simulation; electronic components; fatigue analysis; fatigue failure; finite element model; flexible circuit board fatigue life research; flexible printed circuit board; follow-up test; Fatigue; Load modeling; Materials; Printed circuits; Shafts; Strain; Stress; fatigue analysis; finite element simulation; flexible circuit board; life prediction;

fLanguage

English

Publisher

ieee

Conference_Titel

Measuring Technology and Mechatronics Automation (ICMTMA), 2011 Third International Conference on

Conference_Location

Shangshai

Print_ISBN

978-1-4244-9010-3

Type

conf

DOI

10.1109/ICMTMA.2011.404

Filename

5721222