A 50 watt monolithic surface-mount series-shunt PIN diode switch with integrated thermal sink

Author

Brogle, James J. ; Hubert, Roger J. ; Boles, Timothy E.

Author_Institution

M/A-COM Technol. Solutions Inc., Lowell, MA, USA

fYear

2010

fDate

7-10 Dec. 2010

Firstpage

1739

Lastpage

1742

Abstract

A new monolithic surface-mount RF PIN diode switch topology that provides a significant improvement over the power handling and bandwidth characteristics of discrete surface-mount PIN diode switches has been developed. It employs M/A-COM Technology Solutions´ patented silicon-glass HMIC process, and a unique patented HMIC topology providing 1) a separate series PIN diode thermal sink for increased power handling performance and 2) lower parasitic impedances than discrete packaged components. Test results of an HMIC-fabricated SPST switch are presented and compared with simulations and measurements of a discrete diode switch.

Keywords

elemental semiconductors; heat sinks; microwave integrated circuits; p-i-n diodes; silicon; surface mount technology; switches; M/A-COM Technology Solutions; RF switch; Si; discrete packaged components; discrete surface-mount PIN diode switches; heterolithic microwave integrated circuit; integrated thermal sink; monolithic surface-mount PIN diode switch; power 50 W; power handling; series-shunt PIN diode switch; silicon-glass HMIC process; Insertion loss; Loss measurement; PIN photodiodes; Radio frequency; Switches; Thermal resistance; MMIC switches; epoxy resin insulators; integrated circuit thermal factors; microwave power transmission; p-i-n diodes; surface mounting;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings (APMC), 2010 Asia-Pacific

Conference_Location

Yokohama

Print_ISBN

978-1-4244-7590-2

Electronic_ISBN

978-1-902339-22-2

Type

conf

Filename

5728262