• DocumentCode
    540552
  • Title

    Folded substrate-integrated waveguide out-of-phase power divider

  • Author

    Eccleston, K.W.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Canterbury, Christchurch, New Zealand
  • fYear
    2010
  • fDate
    7-10 Dec. 2010
  • Firstpage
    1260
  • Lastpage
    1263
  • Abstract
    An out-of-phase broad-band substrate-integrated waveguide power divider is proposed. The divider uses a folded substrate-integrated waveguide to split an input signal into a pair of half-mode substrate-integrated waveguides. Due to the field distribution in the folded substrate-integrated waveguide, this power split is out-of-phase. Broadband performance is achieved due to the similar field distributions in the folded and half-mode substrate integrated waveguides. Simulations of an X-band divider confirmed the operational principles of the divider and demonstrated good performance from 8 to 10 GHz.
  • Keywords
    microwave devices; power dividers; substrate integrated waveguides; X-band divider; broadband power divider; field distribution; folded substrate-integrated waveguide; frequency 8 GHz to 10 GHz; frequency 8 GHz to 12 GHz; half-mode substrate integrated waveguides; out-of-phase power divider; power split; Conductors; Insertion loss; Microstrip; Microwave filters; Power dividers; Substrates; folded substrate-integrated waveguide; half-mode substrate-integrated waveguide; power dividers; substrate-integrated waveguide; waveguide components;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings (APMC), 2010 Asia-Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    978-1-4244-7590-2
  • Electronic_ISBN
    978-1-902339-22-2
  • Type

    conf

  • Filename
    5728433