Title :
Copper balls interconnection technology for 60 GHz band 3-D system-in-package modules
Author :
Yoshida, Satoshi ; Tanifuji, Shoichi ; Kameda, Suguru ; Suematsu, Noriharu ; Takagi, Tadashi ; Tsubouchi, Kazuo
Author_Institution :
Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
Abstract :
In this paper, we propose a novel copper balls interconnection technology for 60 GHz band 3-D system-in-package (SiP) modules for 10 mm square 60 GHz band ultra-small wireless personal area network (WPAN) using organic substrates. Copper ball diameter of 350 μm is used for interconnection between the substrates. Ground copper balls placement is discussed showing electric field distribution. As a result, six ground copper balls around vertical signal line interconnection part are crucial for improvement of transmission characteristics. The six ground copper balls interconnection structure have similar results up to about 70 GHz for S21 compared with through CPW, hence copper balls interconnection technology is usable up to about 70 GHz.
Keywords :
copper; integrated circuit interconnections; millimetre wave integrated circuits; personal area networks; system-in-package; 3D system-in-package module; CPW; Cu; SiP module; WPAN; copper balls interconnection technology; electric field distribution; frequency 60 GHz; organic substrate; size 10 mm; size 350 mum; ultra-small wireless personal area network; vertical signal line interconnection part; Coplanar waveguides; Copper; Microwave communication; Millimeter wave communication; Simulation; Substrates; Transmission line measurements; 60 GHz; WPAN; millimeter-wave; small terminal; system-in-package;
Conference_Titel :
Microwave Conference Proceedings (APMC), 2010 Asia-Pacific
Conference_Location :
Yokohama
Print_ISBN :
978-1-4244-7590-2
Electronic_ISBN :
978-1-902339-22-2
