Antenna-in-package technology: The key to success of 60-GHz radio

We introduce the exposure and interference regulations for the 60-GHz band in terms of allowable level of transmit power and antenna gain for different regions of the world. We examine the current development of 60-GHz radio chipsets with an interest in antenna-circuit interfaces and emphasize importance of low-loss interconnection between a chip and an antenna, leading to the Antenna-in-Package (AiP) technology. We evaluate various substrate materials and processes for mass production of AiPs. We demonstrate that LTCC-based AiPs have achieved excellent performance. Hence, we believe that the AiP technology has a great potential as the mainstream antenna solution to the 60-GHz radio chipsets for short-range high-speed wireless communications.