DocumentCode
540688
Title
5 GHz band low phase noise Si-CMOS oscillator with flip-chip mounted FBAR
Author
Ta, Tuan Thanh ; Ando, Kei ; Tanifuji, Shoichi ; Kameda, Suguru ; Suematsu, Noriharu ; Takagi, Tadashi ; Tsubouchi, Kazuo
Author_Institution
Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
fYear
2010
fDate
7-10 Dec. 2010
Firstpage
1039
Lastpage
1042
Abstract
Low phase noise 5 GHz oscillator is designed with 90 nm silicon complementary metal oxide semiconductor (Si-CMOS) process. To achieve low phase noise, we used high Q value film bulk acoustic resonator (FBAR) instead of conventional LC resonant circuit. FBAR was mounted by using stud bump bonding instead of wire bonding to reduce parasitic inductance. This FBAR oscillator has phase noise of lower than -108dBc/Hz at 100 kHz offset.
Keywords
CMOS analogue integrated circuits; acoustic resonators; elemental semiconductors; field effect MMIC; flip-chip devices; lead bonding; microwave oscillators; phase noise; silicon; Si; Si-CMOS oscillator; bandwidth 5 GHz; bump bonding; film bulk acoustic resonator; flip-chip mounted FBAR; low phase noise; silicon complementary metal oxide semiconductor process; size 90 nm; wire bonding; Bonding; Film bulk acoustic resonators; Frequency measurement; Phase noise; Silicon; Wire; 5 GHz; 90 nm silicon complementary metal oxide semiconductor (Si-CMOS); film bulk acoustic resonator (FBAR); low phase noise; oscillator;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference Proceedings (APMC), 2010 Asia-Pacific
Conference_Location
Yokohama
Print_ISBN
978-1-4244-7590-2
Electronic_ISBN
978-1-902339-22-2
Type
conf
Filename
5728571
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