• DocumentCode
    540688
  • Title

    5 GHz band low phase noise Si-CMOS oscillator with flip-chip mounted FBAR

  • Author

    Ta, Tuan Thanh ; Ando, Kei ; Tanifuji, Shoichi ; Kameda, Suguru ; Suematsu, Noriharu ; Takagi, Tadashi ; Tsubouchi, Kazuo

  • Author_Institution
    Res. Inst. of Electr. Commun., Tohoku Univ., Sendai, Japan
  • fYear
    2010
  • fDate
    7-10 Dec. 2010
  • Firstpage
    1039
  • Lastpage
    1042
  • Abstract
    Low phase noise 5 GHz oscillator is designed with 90 nm silicon complementary metal oxide semiconductor (Si-CMOS) process. To achieve low phase noise, we used high Q value film bulk acoustic resonator (FBAR) instead of conventional LC resonant circuit. FBAR was mounted by using stud bump bonding instead of wire bonding to reduce parasitic inductance. This FBAR oscillator has phase noise of lower than -108dBc/Hz at 100 kHz offset.
  • Keywords
    CMOS analogue integrated circuits; acoustic resonators; elemental semiconductors; field effect MMIC; flip-chip devices; lead bonding; microwave oscillators; phase noise; silicon; Si; Si-CMOS oscillator; bandwidth 5 GHz; bump bonding; film bulk acoustic resonator; flip-chip mounted FBAR; low phase noise; silicon complementary metal oxide semiconductor process; size 90 nm; wire bonding; Bonding; Film bulk acoustic resonators; Frequency measurement; Phase noise; Silicon; Wire; 5 GHz; 90 nm silicon complementary metal oxide semiconductor (Si-CMOS); film bulk acoustic resonator (FBAR); low phase noise; oscillator;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings (APMC), 2010 Asia-Pacific
  • Conference_Location
    Yokohama
  • Print_ISBN
    978-1-4244-7590-2
  • Electronic_ISBN
    978-1-902339-22-2
  • Type

    conf

  • Filename
    5728571