DocumentCode :
540924
Title :
How materials behaviour affects power electronics reliability
Author :
Poech, Max H.
Author_Institution :
Fraunhofer Inst. fur Siliziumtechnologie, Itzehoe, Germany
fYear :
2010
fDate :
16-18 March 2010
Firstpage :
1
Lastpage :
6
Abstract :
Life-time of power electronics assemblies is limited, mainly due to the numerous thermal cycles experienced in the mission profile. Differences in thermal expansion coefficients (CTE) of materials cause fatigue degradation, both in active power cycling as well as in passive ambient or cooling medium temperature cycling. To understand the load and the degradation mechanisms due to thermal cycling, thermal-mechanical models are presented to assess the materials behaviour. Models and calculated results will be presented for the bond-wire lift-off failures and for crack propagation in large-area solder joints. Reasonable agreement with available experimental data has been achieved.
Keywords :
circuit reliability; fatigue; fracture mechanics; power electronics; solders; thermal expansion; active power cycling; bond-wire lift-off failures; crack propagation; fatigue degradation; large-area solder joints; power electronic reliability; temperature cycling; thermal cycling; thermal expansion coefficients; thermal-mechanical models; Copper; Fatigue; Lead; Load modeling; Silicon; Strain; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Integrated Power Electronics Systems (CIPS), 2010 6th International Conference on
Conference_Location :
Nuremberg
Print_ISBN :
978-1-61284-814-3
Electronic_ISBN :
978-3-8007-3212-8
Type :
conf
Filename :
5730636
Link To Document :
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