• DocumentCode
    540951
  • Title

    Innovative materials of automotive power packaging

  • Author

    Tan, Ky Lim ; Vivet, Laurent ; Morelle, Jean Michel ; Pierre, Bertrand ; Bienve-Nu, Y. ; Kaabi, Abderrahmen

  • Author_Institution
    Valeo, Creteil, France
  • fYear
    2010
  • fDate
    16-18 March 2010
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Automotive industries require new technologies to fulfil the electrical and hybrid vehicle applications. The current substrate materials for power module are not suitable for these applications because of the performance (mismatch in CTE for copper lead frame for instance) and the cost (high manufacturing cost and poor machinability for DBC AlN substrate for instance). The aim of the investigation is to develop multi functional materials that achieve the high performance in the thermal, electrical and mechanical properties required by the hybrid and electrical vehicle application while satisfying high volume production constraints. The development is focused on the composite and co-laminated materials that can improve thermal, mechanical and electrical characteristics while adapting to automotive lean manufacturing.
  • Keywords
    automotive electronics; automotive materials; hybrid electric vehicles; innovation management; lean production; thermal management (packaging); automotive industries; automotive lean manufacturing; automotive power packaging; colaminated materials; composite materials; electrical properties; hybrid electric vehicles; innovative materials; mechanical properties; multifunctional materials; power modules; thermal properties; Conductivity; Copper; Heating; Multichip modules; Substrates; Thermal conductivity; Thermal expansion; CTE; composite material; power cycling; power packaging; reliability; substrate; thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Power Electronics Systems (CIPS), 2010 6th International Conference on
  • Conference_Location
    Nuremberg
  • Print_ISBN
    978-1-61284-814-3
  • Type

    conf

  • Filename
    5730664