Title :
Innovative materials of automotive power packaging
Author :
Tan, Ky Lim ; Vivet, Laurent ; Morelle, Jean Michel ; Pierre, Bertrand ; Bienve-Nu, Y. ; Kaabi, Abderrahmen
Author_Institution :
Valeo, Creteil, France
Abstract :
Automotive industries require new technologies to fulfil the electrical and hybrid vehicle applications. The current substrate materials for power module are not suitable for these applications because of the performance (mismatch in CTE for copper lead frame for instance) and the cost (high manufacturing cost and poor machinability for DBC AlN substrate for instance). The aim of the investigation is to develop multi functional materials that achieve the high performance in the thermal, electrical and mechanical properties required by the hybrid and electrical vehicle application while satisfying high volume production constraints. The development is focused on the composite and co-laminated materials that can improve thermal, mechanical and electrical characteristics while adapting to automotive lean manufacturing.
Keywords :
automotive electronics; automotive materials; hybrid electric vehicles; innovation management; lean production; thermal management (packaging); automotive industries; automotive lean manufacturing; automotive power packaging; colaminated materials; composite materials; electrical properties; hybrid electric vehicles; innovative materials; mechanical properties; multifunctional materials; power modules; thermal properties; Conductivity; Copper; Heating; Multichip modules; Substrates; Thermal conductivity; Thermal expansion; CTE; composite material; power cycling; power packaging; reliability; substrate; thermal conductivity;
Conference_Titel :
Integrated Power Electronics Systems (CIPS), 2010 6th International Conference on
Conference_Location :
Nuremberg
Print_ISBN :
978-1-61284-814-3