DocumentCode :
54273
Title :
Ultra-Wide Intermediate Bandwidth for High-Frequency SIS Mixers
Author :
Boon-Kok Tan ; Yassin, G. ; Grimes, Paul
Author_Institution :
Dept. of Phys. (Astrophys.), Univ. of Oxford, Oxford, UK
Volume :
4
Issue :
2
fYear :
2014
fDate :
Mar-14
Firstpage :
165
Lastpage :
170
Abstract :
We present a simple method for widening the Intermediate frequency (IF) bandwidth of high frequency superconductor-insulator-superconductor (SIS) mixers. The method only requires a mixer with a single ~1 μ m2 tunnel junction and an IF transformer fabricated with standard printed circuit board technology, avoiding the complexity of requiring several very small tunnel junctions in series or the use of on-chip IF tuning circuits. The method is based on employing a multi-stage microstrip IF transformer to transform the dynamic impedance of the SIS mixer chip to 50 Ω output over a wide IF bandwidth. This method assumes moderately high capacitance junction (75 fF/μm2), and is particularly useful for high frequency SIS mixers. In this paper, we shall first describe the design methodology of the IF transformer using an existing 650 GHz SIS mixer chip design as an illustration and then present the measured IF performance of the mixer.
Keywords :
microstrip circuits; millimetre wave mixers; printed circuits; superconducting microwave devices; superconductor-insulator-superconductor mixers; transformers; IF transformer; dynamic impedance; frequency 650 GHz; high capacitance junction; high frequency superconductor-insulator-superconductor mixer; high-frequency SIS mixers; intermediate frequency bandwidth; multistage microstrip IF transformer; on-chip IF tuning circuits; resistance 50 ohm; standard printed circuit board technology; tunnel junction; ultrawide intermediate bandwidth; Bandwidth; Capacitance; Impedance; Integrated circuit modeling; Junctions; Mixers; Radio frequency; Mixers; submillimeter-wave devices; superconducting integrated circuits; system-on-a-chip;
fLanguage :
English
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-342X
Type :
jour
DOI :
10.1109/TTHZ.2013.2296567
Filename :
6705705
Link To Document :
بازگشت