DocumentCode
544064
Title
Enabling multi-point haptic grasping in virtual environments
Author
Ang, Quan-Zen ; Horan, Ben ; Najdovski, Zoran ; Nahavandi, Saeid
Author_Institution
Centre for Intell. Syst. Res. Lab., Deakin Univ., Geelong, VIC, Australia
fYear
2011
fDate
19-20 March 2011
Firstpage
55
Lastpage
58
Abstract
Haptic interaction has received increasing research interest in recent years. Currently, most commercially available haptic devices provide the user with a single point of interaction. Multi-point haptic devices present a logical progression in device design and enable the operator to experience a far wider range of haptic interactions, particularly the ability to grasp via multiple fingers. This is highly desirable for various haptically enabled applications including virtual training, telesurgery and telemanipulation. This paper presents a gripper attachment which utilises two low-cost commercially available haptic devices to facilitate multi-point haptic grasping. It provides the ability to render forces to the user´s fingers independently and using Phantom Omni haptic devices offers several benefits over more complex approaches such as low-cost, reliability, and ease of programming. The workspace of the gripper attachment is considered and in order to haptically render the desired forces to the user´s fingers, kinematic analysis is discussed and necessary formulations presented. The integrated multi-point haptic platform is presented and exploration of a virtual environment using CHAI 3D is demonstrated.
Keywords
dexterous manipulators; grippers; haptic interfaces; manipulator kinematics; virtual reality; CHAI 3D; Phantom Omni haptic devices; gripper attachment; haptic interaction; kinematic analysis; multiple fingers; multipoint haptic devices; multipoint haptic grasping; virtual environments; Fingers; Grasping; Grippers; Hip; Joints; Phantoms; CHAI 3D; haptic grasp; haptic gripper; multi-point haptic; object manipulation; virtual reality;
fLanguage
English
Publisher
ieee
Conference_Titel
3D User Interfaces (3DUI), 2011 IEEE Symposium on
Conference_Location
Singapore
Print_ISBN
978-1-4577-0063-7
Electronic_ISBN
978-1-4577-0064-4
Type
conf
DOI
10.1109/3DUI.2011.5759217
Filename
5759217
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