• DocumentCode
    546863
  • Title

    Application of Infrared Sulfur Analyzer on the study of phosphor-gypsum decomposition

  • Author

    Ying Guoliang ; Zhou Mingkai ; Li Beixing ; Xie Tian

  • Author_Institution
    Key Lab. of Silicate Mater. Sci. & Eng., Wuhan Univ. of Technol., Wuhan, China
  • Volume
    1
  • fYear
    2011
  • fDate
    20-22 May 2011
  • Firstpage
    973
  • Lastpage
    976
  • Abstract
    In order to develop automatic test so as to improve test efficiency and reduce test time, a new test method is designed to measure the desulphurization degree during thermal decomposition of phosphor-gypsum (or phosphogypsum). In this paper, an Infrared Sulfur Analyzer is set to measure the desulphurization degree of phosphor-gypsum more quickly, more conveniently, more continuously and more accurately. The desulphurization degree curve is obtained based on the test results. Besides, the corresponding regression equation are obtained, according to the test results, which shows that the desulphurization degree increase with the rising of temperature in the range of 1250-1300°C quickly, however, this increasing is not obvious when above 1300°C. The decomposition degree of phosphor-gypsum could be judged quickly and directly according to the regression equations above mentioned.
  • Keywords
    chemical analysis; infrared spectra; phosphors; pyrolysis; regression analysis; automatic test; decomposition degree; desulphurization degree curve; infrared sulfur analyzer; phosphor-gypsum decomposition; regression equation; temperature 1250 degC to 1300 degC; test efficiency; test method; test time; thermal decomposition; Atmospheric measurements; Computational modeling; Ferrites; Particle measurements; Temperature measurement; Thermal decomposition; Time measurement; Infrared Sulfur Analyzer; kinetics; phosphor-gypsum; thermal decomposition;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Materials for Renewable Energy & Environment (ICMREE), 2011 International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-61284-749-8
  • Type

    conf

  • DOI
    10.1109/ICMREE.2011.5930964
  • Filename
    5930964