A cool packaging technology for power conversion application

Author

Fu, Xiao ; Jin, M.

Author_Institution

Coll. of Econ. & Manage., Chongqing Univ. of Posts & Telecommun., Chongqing, China

Volume

2

fYear

2011

fDate

10-12 June 2011

Firstpage

293

Lastpage

296

Abstract

Power management relieves critical bottlenecks in saving electrical energy and efficient switching devices are particularly required for synchronous power conversion module. To optimize both switching and thermal efficiencies for convertor configuration it relies on the advanced package technology. An analysis has been undertaken in this work to identify the challenge on power electronic packages to ensure the system efficiencies continue to increase. This paper presents an innovative three-dimension (3D) packaging technology - CoolPAK, which enables high voltage, high frequency and high reliable voltage switching with reduced power loss in thermal dissipation.

Keywords

power conversion; switching convertors; thermal management (packaging); CoolPAK; cool packaging technology; electrical energy saving; innovative three-dimension packaging technology; power electronic packages; power loss; power management; switching convertor; switching devices; synchronous power conversion module; system efficiency; thermal dissipation; thermal efficiency; voltage switching; Bonding; Copper; Electronic packaging thermal management; Lead; Switches; Thermal resistance; half- bridge circuit; power convertor; semiconductor package; switching efficiency; thermal efficiency;

fLanguage

English

Publisher

ieee

Conference_Titel

Computer Science and Automation Engineering (CSAE), 2011 IEEE International Conference on

Conference_Location

Shanghai

Print_ISBN

978-1-4244-8727-1

Type

conf

DOI

10.1109/CSAE.2011.5952473

Filename

5952473