Title :
Image Acquisition Designing for SMT Solder Paste Deposition 3D Inspection
Author :
Luo, Bing ; Kou, Guanzhong
Author_Institution :
Sch. of Inf. Eng., Wuyi Univ., Jiangmen, China
Abstract :
SMT solder paste deposition quality can be quickly inspected by 3D machine vision based on structured light projection. Digital image acquisition unit designing is one of the most important parts of the inspection system. This paper described a new structure of image acquisition unit designed for solder paste 3D inspection including camera, lens and projector choices, setting and calibration. The image acquisition and calibration experimental results showed that the designed image acquisition unit could satisfy the 3D inspection precision demands.
Keywords :
calibration; cameras; computer vision; electronics industry; inspection; production engineering computing; soldering; surface mount technology; 3D machine vision; SMT solder paste deposition 3D inspection; calibration experimental results; camera; digital image acquisition unit design; lens; projector; structured light projection; Calibration; Cameras; Charge coupled devices; Inspection; Lenses; Pixel; Three dimensional displays; calibration; image acquisition; machine vision; phase measuring profilometry; solder paste inspection;
Conference_Titel :
Multimedia and Signal Processing (CMSP), 2011 International Conference on
Conference_Location :
Guilin, Guangxi
Print_ISBN :
978-1-61284-314-8
Electronic_ISBN :
978-1-61284-314-8
DOI :
10.1109/CMSP.2011.59
