Data analysis of three procedures for constructing semiconductors: Mold, Solder Ball and Singulation

Author

Faria, Brfgida Monica

Author_Institution

Dept. de Electron., Telecomun. e Inf., Univ. de Aveiro, Aveiro e Porto, Portugal

fYear

2011

fDate

15-18 June 2011

Firstpage

1

Lastpage

6

Abstract

Semiconductor´s production is a complex process that involves several sequential steps until obtaining the final product. Team and machine fault detection and performance analysis, in the manufacturing process, are essential to the success of a company in this field. This paper presents the results obtained by applying multivariate statistical methods to data on three processes of the production line of a semiconductor company: Molding, Solder Ball Attach and Singulation. From the analysis of the real data it can be concluded that there are statistical differences regarding the performance, concerning the time taken and number of faults, of the four teams that operate on the company analyzed.

Keywords

data analysis; fault diagnosis; moulding; production engineering computing; semiconductor industry; solders; statistical analysis; data analysis; machine fault detection; manufacturing process; molding; multivariate statistical method; production line; semiconductor company; semiconductor construction; semiconductor production; singulation; solder ball attach; team performance analysis; Companies; Media; Clustering; Mold; Principal Component Analysis; Semiconductor; Singulation; Solder Ball;

fLanguage

English

Publisher

ieee

Conference_Titel

Information Systems and Technologies (CISTI), 2011 6th Iberian Conference on

Conference_Location

Chaves

Print_ISBN

978-1-4577-1487-0

Type

conf

Filename

5974227