Title :
Data analysis of three procedures for constructing semiconductors: Mold, Solder Ball and Singulation
Author :
Faria, Brfgida Monica
Author_Institution :
Dept. de Electron., Telecomun. e Inf., Univ. de Aveiro, Aveiro e Porto, Portugal
Abstract :
Semiconductor´s production is a complex process that involves several sequential steps until obtaining the final product. Team and machine fault detection and performance analysis, in the manufacturing process, are essential to the success of a company in this field. This paper presents the results obtained by applying multivariate statistical methods to data on three processes of the production line of a semiconductor company: Molding, Solder Ball Attach and Singulation. From the analysis of the real data it can be concluded that there are statistical differences regarding the performance, concerning the time taken and number of faults, of the four teams that operate on the company analyzed.
Keywords :
data analysis; fault diagnosis; moulding; production engineering computing; semiconductor industry; solders; statistical analysis; data analysis; machine fault detection; manufacturing process; molding; multivariate statistical method; production line; semiconductor company; semiconductor construction; semiconductor production; singulation; solder ball attach; team performance analysis; Companies; Media; Clustering; Mold; Principal Component Analysis; Semiconductor; Singulation; Solder Ball;
Conference_Titel :
Information Systems and Technologies (CISTI), 2011 6th Iberian Conference on
Conference_Location :
Chaves
Print_ISBN :
978-1-4577-1487-0
