DocumentCode :
549493
Title :
3D heterogeneous system integration: Application driver for 3D technology development
Author :
Beyne, Eric ; Marchal, Pol ; Van der Plas, Geert
Author_Institution :
Imec, Leuven, Belgium
fYear :
2011
fDate :
5-9 June 2011
Firstpage :
213
Lastpage :
213
Abstract :
Three dimensional integration complements semiconductor scaling; it enables a higher integration density as well as heterogeneous technology integration. Using 3D chip stacking, it is possible to extend the number of functions per 3D chip well beyond the near-term capabilities of traditional scaling. The 3D strata may be realized using advanced CMOS technology nodes but may also exploit a wide variety of device technologies to optimize system performance.
Keywords :
CMOS integrated circuits; integrated circuit interconnections; semiconductor device packaging; 3D chip stacking; 3D heterogeneous system integration; 3D interconnects; 3D strata; 3D technology development; advanced CMOS technology; application driver; semiconductor scaling; Integrated circuit interconnections; Integrated circuit modeling; Stress; System-on-a-chip; Three dimensional displays; Through-silicon vias;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference (DAC), 2011 48th ACM/EDAC/IEEE
Conference_Location :
New York, NY
ISSN :
0738-100x
Print_ISBN :
978-1-4503-0636-2
Type :
conf
Filename :
5981755
Link To Document :
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