Title :
Direct matrix solution of linear complexity for surface integral-equation based impedance extraction of high bandwidth interconnects
Author :
Chai, Wenwen ; Jiao, Dan
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Abstract :
A linear-complexity direct matrix solution is developed for the surface-integral based impedance extraction of arbitrarily-shaped 3-D non-ideal conductors embedded in dielectric materials. It outperforms state-of-the-art impedance solvers with fast CPU-time, modest memory-consumption, and without sacrificing accuracy. The inverse of a 2.6-million-unknown matrix arising from the extraction of large-scale 3-D interconnects was obtained in 1.5 GB memory and 1.3 hours on a 3 GHz CPU.
Keywords :
dielectric materials; integral equations; integrated circuit interconnections; three-dimensional integrated circuits; CPU-time; arbitrarily-shaped 3D nonideal conductors; dielectric materials; direct matrix solution; frequency 3 GHz; high bandwidth interconnects; impedance extraction; impedance solvers; large-scale 3D interconnects; linear complexity; memory consumption; memory size 1.5 GByte; surface integral-equation; time 1.3 hour; Complexity theory; Conductors; Impedance; Integral equations; Sparse matrices; Spirals; Surface impedance; Impedance extraction; direct solvers; fast integral equation solvers; interconnect;
Conference_Titel :
Design Automation Conference (DAC), 2011 48th ACM/EDAC/IEEE
Conference_Location :
New York, NY
Print_ISBN :
978-1-4503-0636-2
