DocumentCode :
549683
Title :
Deterministic and stochastic component in RESET transient of HfSiO/FUSI gate RRAM stack
Author :
Degraeve, R. ; Goux, L. ; Roussel, Ph ; Wouters, D.J. ; Kittl, J.A. ; Altimime, L. ; Jurczak, M. ; Groeseneken, G.
Author_Institution :
IMEC, Leuven, Belgium
fYear :
2011
fDate :
14-16 June 2011
Firstpage :
28
Lastpage :
29
Abstract :
Resistive RAM (RRAM) is proposed as an alternative concept for future memory technologies. Its operation relies on the voltage-controlled resistance change of a MIM capacitor through a conductive filament. Fundamental understanding of the filament properties is mandatory for further RRAM development. In previous work, we focused on filaments formed in a transistor with SiO2/HfSiO/FUSI stack. In this stack ,a filament in the gate dielectric due to Ni penetration from the NiSi gate is formed, and unipolar RRAM operation with positive gate voltage occurs. The separation of the gate current over source and drain in a transistor can be used to determine the filament location, and reliably allows accurate modeling of current changes during set/reset in an isolated filament. A quantum mechanical (QM) conduction model (details in) allows to extract the main filament properties and track their changes during cycling.
Keywords :
MIM devices; capacitors; fluorine compounds; hafnium compounds; nickel compounds; random-access storage; silicon compounds; uranium compounds; MIM capacitor; NiSi; RESET transient; SiO2-HfSiO-FUSI; conductive filament; deterministic component; filament location; filament properties; gate RRAM stack; gate current; gate dielectric; memory technologies; positive gate voltage; quantum mechanical conduction model; resistive RAM; stochastic component; unipolar RRAM operation; voltage-controlled resistance change; Current measurement; Fitting; Logic gates; Mathematical model; Stochastic processes; Transient analysis; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSIT), 2011 Symposium on
Conference_Location :
Honolulu, HI
ISSN :
0743-1562
Print_ISBN :
978-1-4244-9949-6
Type :
conf
Filename :
5984617
Link To Document :
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