DocumentCode :
549713
Title :
Exact control of junction position and Schottky barrier height in dopant-segregated epitaxial NiSi2 for high performance metal source/drain MOSFETs
Author :
Mizubayashi, W. ; Migita, S. ; Morita, Y. ; Ota, H.
Author_Institution :
MIRAI-NIRC, Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
fYear :
2011
fDate :
14-16 June 2011
Firstpage :
88
Lastpage :
89
Abstract :
This paper reports junction position control and the Schottky barrier height (ΦBn) tuning in ultrathin SOI MOSFETs with epitaxial NiSi2 source/drain (S/D). We demonstrate the junction position control in the lateral direction with preserving the (111) facet in 8-nm-thick SOI using epitaxial NiSi2 growth. ΦBn at epitaxial NiSi2 can be easily controlled by P+ implanted dose using dopant segregation technique, and the saturation drain current (IDSat.) increases due to lowering ΦBn. Thus, epitaxial NiSi2 is a promising metal S/D for future MOSFETs.
Keywords :
MOSFET; Schottky barriers; epitaxial growth; nickel compounds; position control; silicon-on-insulator; NiSi2; Schottky barrier height tuning; dopant segregation technique; dopant-segregated epitaxial source-drain; epitaxial growth; high-performance metal source-drain MOSFET; junction position control; metal S-D; saturation drain current; size 8 nm; ultrathin-SOI MOSFET; Annealing; Epitaxial growth; Junctions; Logic gates; MOSFETs; Metals; Position control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSIT), 2011 Symposium on
Conference_Location :
Honolulu, HI
ISSN :
0743-1562
Print_ISBN :
978-1-4244-9949-6
Type :
conf
Filename :
5984653
Link To Document :
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