Title :
Hot spot cooling evaluation using closed-channel cooling system (C3S) for MPU 3DI application
Author :
Kim, Y.S. ; Kitada, H. ; Ohigashi, R. ; Ichiyanagi, M. ; Nakatsuka, J. ; Kinefuchi, I. ; Matsumoto, Y. ; Ohba, T.
Author_Institution :
Inst. of Eng. Innovation, Univ. of Tokyo, Tokyo, Japan
Abstract :
A novel closed-channel cooling system (C3S) for microprocessor application has been studied. A 0.038 cm2 micro heaters as small as hot spot block in MPUs are fabricated. Maximum temperature was 350 °C at 28 W/cm2 of power density. The cooling system enables decreasing temperature more than 30 °C with the liquid flow rate ranged 200 μl/min. It is found that micro bubble in water affects cooling efficiency due to vaporization kinetics. Cooling by water shows higher efficiency than that of IPA. With keeping lower micro bubble concentration of water, the heater temperature at 268 °C decreases to 143 and 63 °C at the flow rates of 100 and 600 μl/min, respectively.
Keywords :
bubbles; cooling; microprocessor chips; three-dimensional integrated circuits; vaporisation; MPU 3DI application; closed-channel cooling system; hot spot cooling evaluation; microbubble concentration; microprocessor application; power density; vaporization kinetics; Coolants; Glass; Metals; Silicon; Water heating; MEMS; cooling; hot spot; planar type;
Conference_Titel :
VLSI Technology (VLSIT), 2011 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4244-9949-6
