DocumentCode :
549746
Title :
3D integration from the viewpoint of high-end server system design
Author :
Burns, Jeffrey L.
Author_Institution :
T.J. Watson Res. Center, IBM, Yorktown Heights, NY, USA
fYear :
2011
fDate :
14-16 June 2011
Firstpage :
186
Lastpage :
187
Abstract :
3D integration is a promising new technology family with several characteristics that could be exploited to add value to high-performance server systems. Potential benefits include higher computational density, lower power, and increased modularity with respect to 2D implementations. However, 3D affects design in fundamental ways. This paper describes how 3D affects design and architecture, and explains why a multi-disciplinary, co-design approach is needed to realize the full benefits of 3D for high-performance applications.
Keywords :
queueing theory; three-dimensional integrated circuits; 3D integration; high-end server system design; high-performance server systems; multidisciplinary codesign approach; Chip scale packaging; Computer architecture; Integrated circuit interconnections; Microprocessors; Servers; Silicon; Three dimensional displays; 3D; 3D architecture; 3D design; 3DI;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology (VLSIT), 2011 Symposium on
Conference_Location :
Honolulu, HI
ISSN :
0743-1562
Print_ISBN :
978-1-4244-9949-6
Type :
conf
Filename :
5984698
Link To Document :
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