DocumentCode
549877
Title
Measurement, analysis and improvement of supply noise in 3D ICs
Author
Jain, Pulkit ; Jiao, Dong ; Wang, Xiaofei ; Kim, Chris H.
Author_Institution
Dept. of ECE, Univ. of Minnesota, Minneapolis, MN, USA
fYear
2011
fDate
15-17 June 2011
Firstpage
46
Lastpage
47
Abstract
Supply noise measurements from a 3D IC have been presented for the first time. IR noise rather than Ldi/dt noise is shown to be dominant due to the fewer supply pins and the additional resistance from the through-silicon vias (TSVs). Kelvin probing for IR noise reveals that the effect of pins is significantly more than TSVs. A novel multi-story power delivery is demonstrated for a 393 kb SRAM suppressing the IR noise by 30-70%.
Keywords
SRAM chips; integrated circuit noise; power supplies to apparatus; three-dimensional integrated circuits; 3D IC; IR noise; Kelvin probing; SRAM; TSV; supply noise measurements; through-silicon vias; Noise; Noise measurement; Random access memory; Resistance; Three dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Circuits (VLSIC), 2011 Symposium on
Conference_Location
Honolulu, HI
ISSN
2158-5601
Print_ISBN
978-1-61284-175-5
Type
conf
Filename
5986417
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