DocumentCode
55088
Title
Analytical and Finite-Element Modeling of a Two-Contact Circular Test Structure for Specific Contact Resistivity
Author
Pan, Yongping ; Reeves, Geoffrey K. ; Leech, Patrick W. ; Holland, Anthony S.
Author_Institution
Sch. of Electr. & Comput. Eng., R. Melbourne Inst. of Technol., Melbourne, VIC, Australia
Volume
60
Issue
3
fYear
2013
fDate
Mar-13
Firstpage
1202
Lastpage
1207
Abstract
The specific contact resistivity of a metal-semiconductor ohmic contact can be determined using a number of different test structures, and several of these use the transmission line model approach. In the circular transmission line model test structure, the concentric circular contacts have circular equipotentials in the semiconductor layer, and transmission line model equations can be used to describe their current-voltage behavior. Using test structures with two circular contacts of three different sizes, we present a new technique for determining specific contact resistivity. The analytical expressions are developed and presented, and finite-element modeling results are undertaken to demonstrate the accuracy of the technique. The scaling behavior of this test structure is also discussed. There are no error corrections required for determining contact parameters using the presented test structure.
Keywords
contact resistance; finite element analysis; ohmic contacts; semiconductor-metal boundaries; transmission line theory; circular equipotentials; circular-transmission line model test structure; concentric circular contacts; current-voltage behavior; finite element modeling; metal-semiconductor ohmic contact; scaling behavior; semiconductor layer; specific contact resistivity; transmission line model equation; two-contact circular test structure; Conductivity; Contact resistance; Electrodes; Finite element methods; Ohmic contacts; Resistance; Semiconductor device modeling; Contact resistance; ohmic contact; specific contact resistivity;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2242076
Filename
6461397
Link To Document