Freestanding copper nanocones for field emission by ion-track technology and electrodeposition

Author

Alber, I. ; Krieg, J. ; Müller, C. ; Toimil-Molares, M.E. ; Trautmann, C. ; Serbun, P. ; Jordan, F. ; Navitski, A. ; Müller, G.

Author_Institution

Mater. Res., GSI Helmholtz Centre for Heavy Ion Res., Darmstadt, Germany

fYear

2011

fDate

18-22 July 2011

Firstpage

75

Lastpage

76

Abstract

Freestanding copper nanocones (Cu-NC) are fabricated by electrodeposition in etched ion-track membranes for field emission investigations. Different deposition conditions of the Cu-NC were studied in order to get mechanically stable cones with good electrical contact to the substrate. Electrodeposition at -40 mV lead to a slow growth rate, resulting in uniform and mechanically stabile Cu-NC of about 28 μm length, 1.2 μm base radius, and 190 nm tip radius. The deposition process was monitored via current-vs-time curves.

Keywords

cathodes; copper; electrodeposition; electron field emission; etching; nanotechnology; Cu; current-vs-time curves; electrodeposition; etched ion-track membranes; field emission; freestanding copper nanocones; size 1.2 mum; size 190 nm; size 28 mum; voltage -40 mV; Cathodes; Copper; Etching; Iron; Methanol; Substrates; Nanocones; electrodeposition; ion-track technology; one-side etching;

fLanguage

English

Publisher

ieee

Conference_Titel

Vacuum Nanoelectronics Conference (IVNC), 2011 24th International

Conference_Location

Wuppertal

ISSN

pending

Print_ISBN

978-1-4577-1243-2

Electronic_ISBN

pending

Type

conf

Filename

6004569