Title :
Effect of high-temperature solder void on heat dissipation performance of Smart Power Module
Author :
Zhai, Mingjing ; Guo, Mengjie
Author_Institution :
Dept. EE, Changzhou Inst. of Technol., Changzhou, China
Abstract :
In this paper, the relationship between high-temperature solder void of the IGBT (Insulated Gate Bipolar Transistor) & FWD (Freewheeling Diode) and heat dissipation of the SPM (Smart Power Module) is investigated using both thermal simulation and experimental method. A 3-D thermal model for fast and accurate thermal simulation of the SPM is developed. The solution can describe the variation of temperature through the whole SPM structure with different high-temperature solder void rate. By means of finite element simulation method the effect of high-temperature solder void on heat dissipation of the SPM has been implemented. The simulation results have been validated by a number of experiments and shows good agreement.
Keywords :
cooling; diodes; finite element analysis; hybrid integrated circuits; insulated gate bipolar transistors; power integrated circuits; solders; 3D thermal model; freewheeling diode; heat dissipation performance; high-temperature solder void; insulated gate bipolar transistor; smart power module; thermal simulation; Boundary conditions; Finite element methods; Heating; Insulated gate bipolar transistors; Materials; Metals; Performance evaluation; IGBT; SPM; finite element; high-temperature solder; thermal model;
Conference_Titel :
Electronics and Optoelectronics (ICEOE), 2011 International Conference on
Conference_Location :
Dalian
Print_ISBN :
978-1-61284-275-2
DOI :
10.1109/ICEOE.2011.6013131
