DocumentCode
552157
Title
MTTF evaluations of encapsulation materials for LED package in accelerated thermal tests
Author
Liou, Jyun-Sian ; Tsai, Chun-Chin ; Cheng, Wei-Chih ; Huang, Shun-Yuan ; Cheng, Gi-Hung ; Chang, Jin-Kai ; Wang, Jimmy ; Cheng, Wood-Hi
Author_Institution
Dept. of Photonics, Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
fYear
2011
fDate
4-8 July 2011
Firstpage
511
Lastpage
512
Abstract
By the shape parameter and scale parameter of Weibull eq, MTTF could be obtained to provide clear values for comparison and understanding. In this study, glass material exhibits about 7 times better in lumen loss at 150°C.
Keywords
cerium; light emitting diodes; optical glass; optical testing; silicones; thermal stability; LED package; SiO2; YAG:Ce; accelerated thermal tests; glass material; lumen loss; mean-time-to-failure; silicone encapsulation; temperature 150 degC; thermal stability; Glass; Light emitting diodes;
fLanguage
English
Publisher
ieee
Conference_Titel
Opto-Electronics and Communications Conference (OECC), 2011 16th
Conference_Location
Kaohsiung
Print_ISBN
978-1-61284-288-2
Electronic_ISBN
978-986-02-8974-9
Type
conf
Filename
6015237
Link To Document