• DocumentCode
    552568
  • Title

    Analysis of industuial competetive power of high-tech industry of Baoding national hign-tech zone

  • Author

    Li, Qiao ; Kong, Hui-Zhen

  • Author_Institution
    Sch. of Econ. & Manage., Hebei Univ. of Sci. & Technol., Shijiazhuang, China
  • Volume
    3
  • fYear
    2011
  • fDate
    10-13 July 2011
  • Firstpage
    974
  • Lastpage
    978
  • Abstract
    Baoding national high-tech zone which takes the new energy as the direction is the only one of the 56 national high-tech zones in China, and it has made great progress in recent years. Data envelopment analysis is a linear programming method of assessing the relative effectiveness, it is often used in multiple inputs, multiple output cases, the efficiency of input-output analysis, and scale effect analysis can be carried out. This method excludes a lot of subjective factors, with a strong objectivity, and it has been applied in many areas. In this paper, we used the method of data envelopment analysis, took the national high-tech zones which are not capital-city high-tech national zones like Baoding, collected the 2009 annual financial data, to analyze the industry competitive power of high-tech industry. On basis of the above analysis, we developed countermeasures for high-tech industry of Baoding national high-tech zone.
  • Keywords
    data envelopment analysis; innovation management; linear programming; Baoding national high-tech zone; data envelopment analysis; financial data; high-tech industry; industrial competitive power; input-output analysis; linear programming method; scale effect analysis; Cybernetics; Data envelopment analysis; Educational institutions; Finance; Indexes; Industries; Machine learning; Industrial competitive power; data envelopment analysis; industry high-tech industry; national high-tech zones;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Machine Learning and Cybernetics (ICMLC), 2011 International Conference on
  • Conference_Location
    Guilin
  • ISSN
    2160-133X
  • Print_ISBN
    978-1-4577-0305-8
  • Type

    conf

  • DOI
    10.1109/ICMLC.2011.6016908
  • Filename
    6016908