Title :
Diffusion soldering for automotive power MOSFETs offers the first 100% lead free die attach
Author :
Purschel, Marco ; Roschlau, K.
Author_Institution :
Infineon Technol. AG, Neubiberg, Germany
fDate :
Aug. 30 2011-Sept. 1 2011
Abstract :
Every year, end of life vehicles generate between 8 and 9 million tons of waste. In the paper the first automotive released lead free power MOSFET with diffusion soldering die attach in a TO package will be introduced.
Keywords :
automotive electronics; microassembling; power MOSFET; soldering; automotive power MOSFETs; diffusion soldering; lead free die attach; Environmentally friendly manufacturing techniques; Lead; MOSFETs; Materials; Microassembly; Resistance; Soldering;
Conference_Titel :
Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on
Conference_Location :
Birmingham
Print_ISBN :
978-1-61284-167-0
Electronic_ISBN :
978-90-75815-15-3
