Title :
A Coffin-Manson model to predict the TRIAC solder joints fatigue during power cycling
Author :
Jacques, S. ; Caldeira, A. ; Batut, N. ; Schellmanns, A. ; Leroy, Rudi ; Gonthier, L.
Author_Institution :
Power Microelectron. Lab. (LMP), Tours Univ., Tours, France
fDate :
Aug. 30 2011-Sept. 1 2011
Abstract :
In this paper, a physical model is proposed to estimate the TRIAC solder joints fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (ΔTcase) is the main acceleration factor, the solder joints are the weakest materials in the TRIAC assembly, and the plastic strain within the solder layer due to shearing is the failure cause.
Keywords :
failure analysis; fatigue testing; semiconductor switches; solders; Coffin-Manson model; TRIAC assembly; TRIAC solder joint fatigue; acceleration factor; bidirectional semiconductor switches; lifetime prediction; physical model; plastic strain; power cycling; solder layer; Acceleration; Copper; Fatigue; Predictive models; Silicon; Soldering; Thyristors; Coffin-Manson; Power cycling; Prediction model; Solder joints fatigue; TRIAC;
Conference_Titel :
Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on
Conference_Location :
Birmingham
Print_ISBN :
978-1-61284-167-0
Electronic_ISBN :
978-90-75815-15-3
