• DocumentCode
    553465
  • Title

    A Coffin-Manson model to predict the TRIAC solder joints fatigue during power cycling

  • Author

    Jacques, S. ; Caldeira, A. ; Batut, N. ; Schellmanns, A. ; Leroy, Rudi ; Gonthier, L.

  • Author_Institution
    Power Microelectron. Lab. (LMP), Tours Univ., Tours, France
  • fYear
    2011
  • fDate
    Aug. 30 2011-Sept. 1 2011
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    In this paper, a physical model is proposed to estimate the TRIAC solder joints fatigue during power cycling. The lifetime prediction is based on the following assumptions: the case temperature swing (ΔTcase) is the main acceleration factor, the solder joints are the weakest materials in the TRIAC assembly, and the plastic strain within the solder layer due to shearing is the failure cause.
  • Keywords
    failure analysis; fatigue testing; semiconductor switches; solders; Coffin-Manson model; TRIAC assembly; TRIAC solder joint fatigue; acceleration factor; bidirectional semiconductor switches; lifetime prediction; physical model; plastic strain; power cycling; solder layer; Acceleration; Copper; Fatigue; Predictive models; Silicon; Soldering; Thyristors; Coffin-Manson; Power cycling; Prediction model; Solder joints fatigue; TRIAC;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on
  • Conference_Location
    Birmingham
  • Print_ISBN
    978-1-61284-167-0
  • Electronic_ISBN
    978-90-75815-15-3
  • Type

    conf

  • Filename
    6020323
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=553465