• DocumentCode
    553505
  • Title

    Design and characterization of planar integrated passive component for power converters

  • Author

    Saijun Mao ; Yingyi Zhang

  • Author_Institution
    GE Global Res. Shanghai, Shanghai, China
  • fYear
    2011
  • fDate
    Aug. 30 2011-Sept. 1 2011
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    This paper proposes the planar passive components integration technology for power converters to investigate the technology feasibility. The planar passive components integration technology with the advantage of component amounts reduction, compact volume, better thermal management, high reliability and potential cost saving is an enabling platform technology for power converters miniaturization. It is introduced to combine inductor (L), capacitor(C) and transformer (T) into a single integrated passive component (L-C-T) to replace the discrete passive components. The manufacture process is fully compatible with PCB process by using embedded capacitor materials. Innovative integration structures with magnetic flux decoupling for planar integrated L-C-T component are proposed. Electromagnetic modeling method with higher accuracy has been developed to predict integrated L-C-T component parameters and electromagnetic field distribution. The prototype of integrated L-C-T component has been tested with promising performance. Planar passive components integration technology application outlook is presented finally.
  • Keywords
    capacitors; electromagnetic fields; inductors; magnetic flux; power convertors; printed circuits; reliability; transformers; L-C-T component parameters; PCB process; compact volume; electromagnetic field distribution; embedded capacitor materials; high reliability; inductor; magnetic flux decoupling; planar passive component integration technology; power converters; thermal management; transformer; Capacitors; Integrated circuit modeling; Legged locomotion; Magnetic cores; Magnetic flux; Materials; Windings; Electromagnetic design; Emagnetic integration; Embedded capacitor material; Passive integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on
  • Conference_Location
    Birmingham
  • Print_ISBN
    978-1-61284-167-0
  • Electronic_ISBN
    978-90-75815-15-3
  • Type

    conf

  • Filename
    6020363