Title :
Impact of source metallization ageing on thermo-mechanical characteristics of a vertical power device
Author :
Marcault, E. ; Breil, Marie ; Bourennane, A. ; Tounsi, Patrick ; Martineau, D. ; Dupuy, P.
Author_Institution :
LAAS, CNRS, Toulouse, France
fDate :
Aug. 30 2011-Sept. 1 2011
Abstract :
Reliability is a major economic and technical challenge for power electronics. This paper aims at exploring the impact of reconstruction of source metallization [1] due to ageing on temperature and mechanical strain distributions within a smart power device. Based on 3D FEM electro-thermal simulations, we explore thermal and mechanical impact of source metallization ageing on bonding wires during operation.
Keywords :
finite element analysis; integrated circuit metallisation; integrated circuit reliability; lead bonding; power integrated circuits; thermal stresses; 3D FEM electrothermal simulations; bonding wires; mechanical strain distributions; power electronic reliability; smart power device; source metallization ageing; temperature strain distributions; thermomechanical characteristics; vertical power device; Aging; Bonding; Conductivity; Materials; Metallization; Temperature; Wires; Reliability; physical simulations; power electronics; temperature; thermo-mechanical stress;
Conference_Titel :
Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on
Conference_Location :
Birmingham
Print_ISBN :
978-1-61284-167-0
Electronic_ISBN :
978-90-75815-15-3
