DocumentCode :
553805
Title :
A monolithically integrated vertical bidirectional IGBT having all the main electrodes on the front side
Author :
Tahir, Hasan ; Bourennane, A. ; Sanchez, Javier ; Breil, Marie ; Crebier, Jean-Christophe ; Pont, L. ; Sarrabayrouse, G.
Author_Institution :
LAAS, CNRS, Toulouse, France
fYear :
2011
fDate :
Aug. 30 2011-Sept. 1 2011
Firstpage :
1
Lastpage :
9
Abstract :
A vertical bidirectional IGBT having all its main electrodes in the front side of the silicon wafer is proposed. The main goal of the proposed structure is to overcome the difficulties and complexity of packaging realization encountered in some of the proposed vertical power bidirectional switches. Indeed, they generally have their main electrodes (anode and cathode) and their MOS gate electrodes on both sides of the wafer. Extensive 2D simulations were used in order to validate the device operating modes and to analyse the device static as well as dynamic performances. The technological process suitable for its realization is also described.
Keywords :
electrochemical electrodes; elemental semiconductors; power semiconductor switches; semiconductor device packaging; silicon; 2D simulations; MOS gate electrodes; Si; device static; monolithically-integrated vertical bidirectional IGBT; packaging realization; silicon wafer; vertical power bidirectional switches; Anodes; Cathodes; Insulated gate bipolar transistors; Logic gates; Switches; Thyristors; Bidirectional IGBT; Bidirectional switch; IGBT; Thyristor; Trench isolation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Electronics and Applications (EPE 2011), Proceedings of the 2011-14th European Conference on
Conference_Location :
Birmingham
Print_ISBN :
978-1-61284-167-0
Electronic_ISBN :
978-90-75815-15-3
Type :
conf
Filename :
6020664
Link To Document :
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