DocumentCode :
554591
Title :
Temperature field of the instrument for measuring the yield stress of magnetorheological fluid
Author :
Zuzhi Tian ; Youfu Hou ; Nannan Wang
Author_Institution :
Coll. of Mech. & Electr. Eng., China Univ. of Min. & Technol., Xuzhou, China
Volume :
5
fYear :
2011
fDate :
12-14 Aug. 2011
Firstpage :
2415
Lastpage :
2418
Abstract :
To obtain the temperature distribution of the instrument for measuring yield stress of magnetorheological fluid and the influence rule of deformation caused by temperature on the magnetic field between disks, on the basis of thermal conduction theory, the temperature field and deformation of disks is studied by the finite element method, the results indicate that the temperature increases along the radius, the highest temperature appears in the section near the edge of disk, the temperature difference is small and the value is 10°C; during the time of 300s, the temperature rises approximately linearly; the structural sizes of disks have an attractive influence on the temperature field, when the slip power is unchanged, the larger the thickness and radius of disk, the lower the average temperature; when the speed keeps constant, the larger the radius the disk, the higher the average temperature and the temperature difference; the deformation of disk is mainly caused by thermal expansion of material and the maximum deformation is 1.38×10-5 mm.
Keywords :
deformation; discs (structures); finite element analysis; heat conduction; instruments; magnetohydrodynamics; magnetorheology; slip flow; temperature distribution; thermal expansion; yield stress; disk deformation analysis; finite element method; magnetorheological fluid; material thermal expansion; slip power analysis; temperature difference analysis; temperature distribution; temperature field; thermal conduction theory; yield stress measuring instrument; Fluids; Instruments; Magnetic fields; Stress; Temperature distribution; Temperature measurement; deformation; magnetorheological fluid; temperature field; yield stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location :
Harbin, Heilongjiang, China
Print_ISBN :
978-1-61284-087-1
Type :
conf
DOI :
10.1109/EMEIT.2011.6023529
Filename :
6023529
Link To Document :
بازگشت