DocumentCode :
554670
Title :
Reliability evaluation of FPC under bending stress
Author :
Zhimin Liu
Author_Institution :
Sch. of Mech., Electron. & Ind. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu, China
Volume :
6
fYear :
2011
fDate :
12-14 Aug. 2011
Firstpage :
2955
Lastpage :
2958
Abstract :
In this paper, finite element analysis method is applied for modeling and simulation of FPC to analyze its mechanical performance under the constant stress. In the simulation process, the bending method used in this research is to fix the middle of the FPC and to impose load on both sides. The results of Von Mises stress distribution between the layers of FPC are presented and analyzed with the knowledge of material mechanics. In addition, the length and the thickness of layers of FPC are taken as optimization variables. With the variables change, there are many different cases. This paper presents the stress comparison with different lengths and thickness of layers of FPC model. The simulation results show that there are different stresses between the layers of FPC model. The disbonding failure may occur between the layers of FPC under high-cycle load and the stress between layers will be reduced by changing the length of model. With ANSYS, the fatigue life of FPC is calculated approximately. The analysis result may provide some help on FPC design and manufacturing.
Keywords :
bending; failure (mechanical); fatigue; finite element analysis; optimisation; printed circuit manufacture; reliability; stress analysis; ANSYS; FPC design; FPC manufacturing; FPC model; Von Mises stress distribution; bending stress; constant stress; disbonding failure; fatigue life; finite element analysis method; flexible printed circuit; high-cycle load; material mechanics; mechanical performance; reliability evaluation; Copper; Fatigue; Finite element methods; Load modeling; Reliability; Stress; Substrates; FPC; finite element analysis; mechanical performance; von mises stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic and Mechanical Engineering and Information Technology (EMEIT), 2011 International Conference on
Conference_Location :
Harbin, Heilongjiang, China
Print_ISBN :
978-1-61284-087-1
Type :
conf
DOI :
10.1109/EMEIT.2011.6023667
Filename :
6023667
Link To Document :
بازگشت