Title :
Improvement of power integrity in SiP modules with miniaturized electromagnetic bandgap structure
Author :
Tseng, Bin-Chyi ; Liao, Li-Chun ; Chao, Chun-Heng
Author_Institution :
Dept. of Electr. Eng., Feng-Chia Univ., Taichung, Taiwan
Abstract :
Designed electromagnetic bandgap (EBG) structures are presented for noise suppression in an 8 mm × 8 mm System-in Package (SiP) module. By embeddeding a spiral inductor, the lower suppression frequency can decrease to 2.3 GHz on a 3 × 3 lattice EBG structure. For practical layout consideration, an improved EBG structure with meandering short stubs is proposed to provide a 26.4% fractional bandwidth.
Keywords :
system-in-package; EBG structures; SiP modules; electromagnetic bandgap structure; noise suppression; power integrity; system-in package module; Equivalent circuits; Frequency measurement; Integrated circuit modeling; Jitter; Modems; Wireless communication; Equivalent circuit model; electromagnetic bandgap; plateform interference; signal integrity;
Conference_Titel :
Cross Strait Quad-Regional Radio Science and Wireless Technology Conference (CSQRWC), 2011
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-9792-8
DOI :
10.1109/CSQRWC.2011.6036949
