Title :
Edge shaping to reduce the electromagnetic emissions
Author :
Deutschmann, Bernd ; Illing, Robert ; Auer, Bernhard
Author_Institution :
Infineon Technol. AG, Neubiberg, Germany
Abstract :
In this paper the reduction of the electromagnetic emission of automotive power ICs by shaping the edges of the switching signal is described. This technique is explained in detail and it is shown how an edge shaping concept was implemented into a high side switch. Using the voltage method defined in CISPR25 the conducted electromagnetic emission of this high side switch was measured. For this purpose an EMC test board was designed and the electromagnetic emission with and without edge shaping are compared.
Keywords :
automotive electronics; electromagnetic compatibility; power integrated circuits; CISPR25; EMC test board; automotive power IC; conducted electromagnetic emission; edge shaping; electromagnetic emission reduction; switching signal; Electromagnetic compatibility; Logic gates; Switches; Switching loss; Time domain analysis; Voltage measurement;
Conference_Titel :
EMC Europe 2011 York
Conference_Location :
York
Print_ISBN :
978-1-4577-1709-3
