Title :
The evaluation method for ESD immunity of components in terms of soft error
Author :
Lim, Jaedeok ; Lee, Jongsung ; Seol, Byongsu ; Nandy, Argha ; Pommerenke, David
Author_Institution :
Global Production Technol. Center, Samsung Electron. Co., Ltd., Suwon, South Korea
Abstract :
A hand-held product like a camera and a mobile-phone must be satisfied with ESD Standard. Mostly IEC 61000-4-2 is applied. In this SET-level ESD test, considerable reason of failure is malfunction of major semiconductor parts (CPU, Memory and Sensor etc.) Recently, due to the semiconductor becoming more refined, high speed and multifunction, that failure trend is getting more general. The importance of cooperation between set developer and component developer has been emphasized in ESD field. Especially, making a correlation in measurement and analytical method is very important. Through this paper, the evaluation method for ESD immunity of components will be suggested for designing ESD robust product.
Keywords :
cameras; electrostatic discharge; mobile handsets; SET-level ESD test; camera; evaluation method; hand-held product; mobile- phone; semiconductor parts; soft error; Electrostatic discharge; Frequency measurement; IEC standards; Immunity testing; Semiconductor device measurement; Voltage measurement; Component-level; ESD; Soft-error;
Conference_Titel :
EMC Europe 2011 York
Conference_Location :
York
Print_ISBN :
978-1-4577-1709-3
